Process Overview
Copper Plating
Copper plating serves dual purposes — as a functional undercoat that improves adhesion and smoothness for subsequent platings, and as a standalone coating where electrical conductivity, heat conduction, or a warm decorative appearance is required. We offer acid copper for levelling and alkaline copper for adhesion on difficult substrates.
Coating Thickness
3–10 µm (strike) | 10–75 µm (functional)
Typical Turnaround
3–5 business days (standard)
Available Types
Types of Copper Plating
Acid Copper
Deposited from a sulphate bath, providing excellent levelling and brightness. Used as a thick undercoat to smooth out surface defects before chrome or nickel plating, and for decorative copper finishes.
Alkaline Copper (Cyanide)
Provides outstanding adhesion on zinc die-castings and steel. Used as a thin strike layer before acid copper to ensure bond integrity on difficult substrates.
Strike Copper
A thin, adherent copper layer applied as the first deposit on substrates that require a special bonding layer before thicker coatings.
Why It Works
Key Advantages
- Excellent electrical and thermal conductivity
- Outstanding undercoat adhesion properties
- Good levelling — fills surface defects
- Warm decorative appearance
- Enables subsequent plating on difficult substrates
- Ductile and malleable deposit
Where It's Used
Applications
- →PCB and electronics manufacturing
- →Undercoat for nickel and chrome plating
- →Electrical busbars and connectors
- →Decorative copper-finished products
- →Zinc die-casting plating preparation
- →EMI shielding applications
How We Do It
Our Process
Substrate preparation and cleaning
Alkaline copper strike (for adhesion)
Acid copper electrodeposition
Intermediate polishing (if required)
Follow-on plating or passivation